P89C51RC2BN/01,112
vs
P89V51RD2BN
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
PHILIPS SEMICONDUCTORS
Part Package Code
DIP
Package Description
DIP, DIP40,.6
DIP-40
Pin Count
40
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
Address Bus Width
16
Bit Size
8
8
CPU Family
8051
8051
Clock Frequency-Max
33 MHz
DAC Channels
NO
DMA Channels
NO
External Data Bus Width
8
JESD-30 Code
R-PDIP-T40
R-PDIP-T40
JESD-609 Code
e3
e3
Length
52 mm
Number of I/O Lines
32
Number of Terminals
40
40
On Chip Program ROM Width
8
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
PWM Channels
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP40,.6
DIP40,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
512
1024
ROM (words)
32768
65536
ROM Programmability
FLASH
FLASH
Seated Height-Max
4.7 mm
Speed
33 MHz
40 MHz
Supply Voltage-Max
5.5 V
Supply Voltage-Min
5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN
Matte Tin (Sn)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
Base Number Matches
1
2
Supply Current-Max
50 mA
Compare P89C51RC2BN/01,112 with alternatives
P89C51RC2BN/01,112 vs P89V51RC2FN
P89C51RC2BN/01,112 vs P89C51RC2BN/01
P89C51RC2BN/01,112 vs P89V51RC2BN
P89C51RC2BN/01,112 vs P89C51RD2BN
P89C51RC2BN/01,112 vs P89C51RD2HBP
P89C51RC2BN/01,112 vs P89V51RD2FN
P89C51RC2BN/01,112 vs P89C51RC2HBP/00
P89C51RC2BN/01,112 vs P89V51RD2FN,112
P89C51RC2BN/01,112 vs P89C51RD2BN/01,112