P87C51RC2BBD
vs
P87C58UFPN
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
PHILIPS SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
QFP, QFP44,.47SQ,32
DIP, DIP40,.6
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Bit Size
8
8
CPU Family
8051
8051
JESD-30 Code
S-PQFP-G44
R-PDIP-T40
JESD-609 Code
e3
Number of Terminals
44
40
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
DIP
Package Equivalence Code
QFP44,.47SQ,32
DIP40,.6
Package Shape
SQUARE
RECTANGULAR
Package Style
FLATPACK
IN-LINE
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
512
256
ROM (words)
32768
32768
ROM Programmability
UVPROM
OTPROM
Speed
33 MHz
33 MHz
Supply Current-Max
4.63 mA
30.8 mA
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn)
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.8 mm
2.54 mm
Terminal Position
QUAD
DUAL
Base Number Matches
2
2
Part Package Code
DIP
Pin Count
40
ECCN Code
3A991.A.2
Has ADC
NO
Address Bus Width
Boundary Scan
NO
Clock Frequency-Max
33 MHz
DAC Channels
NO
DMA Channels
NO
External Data Bus Width
Length
52 mm
Number of I/O Lines
32
On Chip Program ROM Width
8
PWM Channels
YES
Seated Height-Max
4.7 mm
Supply Voltage-Max
5.5 V
Supply Voltage-Min
4.5 V
Supply Voltage-Nom
5 V
Width
15.24 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
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