P80C51FA vs TS80C51RD2-LCBR feature comparison

P80C51FA Intel Corporation

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TS80C51RD2-LCBR Temic Semiconductors

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEL CORP TEMIC SEMICONDUCTORS
Part Package Code DIP
Package Description PLASTIC, DIP-40 PLASTIC, LCC-44
Pin Count 40
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01
Has ADC NO NO
Additional Feature BOOLEAN PROCESSOR; ON-CIRCUIT EMULATION
Address Bus Width 16 16
Bit Size 8 8
Boundary Scan NO
CPU Family 8051 8051
Clock Frequency-Max 12 MHz 30 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
Format FIXED POINT
Integrated Cache NO
JESD-30 Code R-PDIP-T40 S-PQCC-J44
JESD-609 Code e0 e0
Length 52.26 mm
Low Power Mode YES
Number of DMA Channels
Number of External Interrupts 2
Number of I/O Lines 32 32
Number of Serial I/Os 1
Number of Terminals 40 44
Number of Timers 3
On Chip Data RAM Width 8
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
PWM Channels NO YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP QCCJ
Package Equivalence Code DIP40,.6 LDCC44,.7SQ
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE CHIP CARRIER
Qualification Status Not Qualified Not Qualified
RAM (bytes) 256 1024
RAM (words) 256
ROM (words) 0
ROM Programmability ROM LESS
Seated Height-Max 5.08 mm
Speed 12 MHz 30 MHz
Supply Current-Max 30 mA 13 mA
Supply Voltage-Max 6 V 6.05 V
Supply Voltage-Min 4 V 2.43 V
Supply Voltage-Nom 5 V 3.3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE J BEND
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Width 15.24 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 2

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