P80C32EBBB
vs
TS80C52X2-MIBB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
ATMEL CORP
Package Description
QFP,
QCCJ, LDCC44,.7SQ
Reach Compliance Code
unknown
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
NO
Address Bus Width
16
16
Bit Size
8
8
Boundary Scan
NO
NO
Clock Frequency-Max
16 MHz
40 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
8
8
Format
FIXED POINT
Integrated Cache
NO
JESD-30 Code
S-PQFP-G44
S-PQCC-J44
Length
10 mm
16.5862 mm
Low Power Mode
YES
Number of DMA Channels
Number of External Interrupts
2
Number of I/O Lines
32
32
Number of Serial I/Os
1
Number of Terminals
44
44
Number of Timers
3
On Chip Data RAM Width
8
On Chip Program ROM Width
8
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
PWM Channels
NO
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
QCCJ
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
CHIP CARRIER
Qualification Status
Not Qualified
Not Qualified
RAM (words)
256
ROM (words)
0
8192
Seated Height-Max
2.1 mm
4.57 mm
Speed
8 MHz
40 MHz
Supply Current-Max
24.78 mA
27 mA
Supply Voltage-Max
6 V
5.5 V
Supply Voltage-Min
4 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
GULL WING
J BEND
Terminal Pitch
0.8 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
10 mm
16.5862 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
2
Rohs Code
Part Package Code
LCC
Pin Count
44
ECCN Code
3A991.A.2
CPU Family
8051
JESD-609 Code
e0
Moisture Sensitivity Level
2
Package Equivalence Code
LDCC44,.7SQ
Peak Reflow Temperature (Cel)
225
RAM (bytes)
256
ROM Programmability
MROM
Terminal Finish
TIN LEAD
Compare P80C32EBBB with alternatives
Compare TS80C52X2-MIBB with alternatives