P80C32-1
vs
P80C32EBPN
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEMIC SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
DIP-40
DIP-40
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Bit Size
8
8
CPU Family
8051
JESD-30 Code
R-PDIP-T40
R-PDIP-T40
JESD-609 Code
e0
Number of Terminals
40
40
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP40,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
256
Speed
16 MHz
8 MHz
Supply Current-Max
27 mA
24.78 mA
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
5
1
Has ADC
NO
Address Bus Width
16
Boundary Scan
NO
Clock Frequency-Max
16 MHz
DAC Channels
NO
DMA Channels
NO
External Data Bus Width
8
Format
FIXED POINT
Integrated Cache
NO
Length
52 mm
Low Power Mode
YES
Number of DMA Channels
Number of External Interrupts
2
Number of I/O Lines
32
Number of Serial I/Os
1
Number of Timers
3
On Chip Data RAM Width
8
PWM Channels
NO
RAM (words)
256
Seated Height-Max
4.7 mm
Supply Voltage-Max
6 V
Supply Voltage-Min
4 V
Width
15.24 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
Compare P80C32-1 with alternatives
Compare P80C32EBPN with alternatives