P4C1981-25PI
vs
P4C1981L-25CMB
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
PYRAMID SEMICONDUCTOR CORP
PYRAMID SEMICONDUCTOR CORP
Part Package Code
DIP
DIP
Package Description
DIP, DIP28,.3
0.300 INCH, SIDE BRAZED, CERAMIC, DIP-28
Pin Count
28
28
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.41
Access Time-Max
25 ns
25 ns
Additional Feature
TRANSPARENT WRITE
I/O Type
SEPARATE
JESD-30 Code
R-PDIP-T28
R-CDIP-T28
JESD-609 Code
e0
e0
Length
34.8615 mm
34.8615 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
4
4
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
16KX4
16KX4
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Equivalence Code
DIP28,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.334 mm
5.715 mm
Standby Current-Max
0.015 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.155 mA
0.155 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
Screening Level
MIL-STD-883 Class B
Compare P4C1981-25PI with alternatives
Compare P4C1981L-25CMB with alternatives