P4C187-25CI vs P4C187-25CM feature comparison

P4C187-25CI Pyramid Semiconductor Corporation

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P4C187-25CM Pyramid Semiconductor Corporation

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Part Life Cycle Code Active Active
Ihs Manufacturer PYRAMID SEMICONDUCTOR CORP PYRAMID SEMICONDUCTOR CORP
Reach Compliance Code compliant compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 25 ns
I/O Type SEPARATE
JESD-30 Code R-CDIP-T22 R-CDIP-T22
Length 29.337 mm 29.337 mm
Memory Density 65536 bit 65536 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 1 1
Number of Functions 1 1
Number of Ports 1
Number of Terminals 22 22
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 64KX1 64KX1
Output Characteristics 3-STATE
Output Enable NO
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP22,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Seated Height-Max 5.08 mm 5.08 mm
Standby Current-Max 0.015 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.155 mA 0.155 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Part Package Code DIP
Package Description 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-22
Pin Count 22
JESD-609 Code e0
Qualification Status Not Qualified
Screening Level MIL-STD-883 Class B
Temperature Grade MILITARY
Terminal Finish TIN LEAD

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