P4C168-25CM
vs
P4C170-25PC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
PYRAMID SEMICONDUCTOR CORP
PYRAMID SEMICONDUCTOR CORP
Part Package Code
DIP
DIP
Package Description
0.300 INCH, SIDE BRAZED, CERAMIC, DIP-20
0.300 INCH, PLASTIC, DIP-20
Pin Count
20
22
Reach Compliance Code
compliant
compliant
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
25 ns
JESD-30 Code
R-CDIP-T20
R-PDIP-T20
JESD-609 Code
e0
e0
Length
25.908 mm
29.337 mm
Memory Density
16384 bit
16384 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
4
4
Number of Functions
1
1
Number of Terminals
20
20
Number of Words
4096 words
4096 words
Number of Words Code
4000
4000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
4KX4
4KX4
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Seated Height-Max
5.08 mm
5.08 mm
Supply Current-Max
0.12 mA
0.13 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
2
1
Additional Feature
FAST CHIP SELECT CONTROL
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
DIP22,.3
Standby Current-Max
0.13 A
Standby Voltage-Min
4.5 V
Compare P4C168-25CM with alternatives
Compare P4C170-25PC with alternatives