P4C164L-45CWM vs 5962-9559511H9A feature comparison

P4C164L-45CWM Pyramid Semiconductor Corporation

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5962-9559511H9A Mercury Systems Inc

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Rohs Code No
Part Life Cycle Code Active Active
Ihs Manufacturer PYRAMID SEMICONDUCTOR CORP MERCURY SYSTEMS INC
Part Package Code DIP
Package Description 0.600 INCH, CERAMIC, SIDE BRAZED, DIP-28 QFP,
Pin Count 28
Reach Compliance Code compliant compliant
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 45 ns 15 ns
Additional Feature LG-MAX
JESD-30 Code R-CDIP-T28 S-CQFP-G68
Length 37.846 mm 22.36 mm
Memory Density 65536 bit 4194304 bit
Memory IC Type STANDARD SRAM SRAM MODULE
Memory Width 8 32
Number of Functions 1 1
Number of Terminals 28 68
Number of Words 8192 words 131072 words
Number of Words Code 8000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 8KX8 128KX32
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code DIP QFP
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE FLATPACK
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 5.08 mm 3.51 mm
Supply Current-Max 0.145 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm 22.36 mm
Base Number Matches 1 4
JESD-609 Code e0
Qualification Status Qualified
Screening Level MIL-STD-883
Terminal Finish TIN LEAD

Compare P4C164L-45CWM with alternatives

Compare 5962-9559511H9A with alternatives