P4C164L-25LSMLF
vs
MT5C6405EC-70/IT
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
PYRAMID SEMICONDUCTOR CORP
|
MICROSS COMPONENTS
|
Part Package Code |
QLCC
|
QLCC
|
Package Description |
0.350 X 0.550 INCH, ROHS COMPLIANT, CERAMIC, LCC-28
|
QCCN,
|
Pin Count |
28
|
28
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A001.A.2.C
|
EAR99
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
25 ns
|
70 ns
|
JESD-30 Code |
R-CQCC-N28
|
R-CQCC-N28
|
Length |
13.97 mm
|
13.97 mm
|
Memory Density |
65536 bit
|
65536 bit
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
8
|
4
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
28
|
Number of Words |
8192 words
|
16384 words
|
Number of Words Code |
8000
|
16000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Organization |
8KX8
|
16KX4
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
QCCN
|
QCCN
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.905 mm
|
1.905 mm
|
Supply Current-Max |
0.155 mA
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
8.89 mm
|
8.89 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare P4C164L-25LSMLF with alternatives
Compare MT5C6405EC-70/IT with alternatives