P4C164L-25FMB
vs
FTS128K32N-20H3B
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Active
Active
Ihs Manufacturer
PYRAMID SEMICONDUCTOR CORP
FORCE TECHNOLOGIES LTD
Part Package Code
DFP
QFP
Package Description
CERAMIC, DFP-28
QFP,
Pin Count
28
68
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
20 ns
Additional Feature
LG-MAX
I/O Type
COMMON
JESD-30 Code
R-CDFP-F28
S-CQFP-G68
JESD-609 Code
e0
e4
Length
18.542 mm
22.36 mm
Memory Density
65536 bit
4194304 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
32
Number of Functions
1
1
Number of Terminals
28
68
Number of Words
8192 words
131072 words
Number of Words Code
8000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
8KX8
128KX32
Output Characteristics
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DFP
QFP
Package Equivalence Code
FL28,.4
Package Shape
RECTANGULAR
SQUARE
Package Style
FLATPACK
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class B
MIL-STD-883 Class B (Modified)
Seated Height-Max
2.286 mm
5.1 mm
Standby Current-Max
0.0002 A
Standby Voltage-Min
2 V
Supply Current-Max
0.155 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
GOLD
Terminal Form
FLAT
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
QUAD
Width
9.017 mm
22.36 mm
Base Number Matches
2
2
Compare P4C164L-25FMB with alternatives
Compare FTS128K32N-20H3B with alternatives