P4C164L-25FILF
vs
FTS128K32N-25H3C
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
PYRAMID SEMICONDUCTOR CORP
|
FORCE TECHNOLOGIES LTD
|
Part Package Code |
DFP
|
QFP
|
Package Description |
ROHS COMPLIANT, CERAMIC, DFP-28
|
QFP,
|
Pin Count |
28
|
68
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
25 ns
|
25 ns
|
Additional Feature |
LG-MAX
|
|
JESD-30 Code |
R-CDFP-F28
|
S-CQFP-G68
|
Length |
18.542 mm
|
22.36 mm
|
Memory Density |
65536 bit
|
4194304 bit
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
8
|
32
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
68
|
Number of Words |
8192 words
|
131072 words
|
Number of Words Code |
8000
|
128000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
8KX8
|
128KX32
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
DFP
|
QFP
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
FLATPACK
|
FLATPACK
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Seated Height-Max |
2.286 mm
|
5.1 mm
|
Supply Current-Max |
0.155 mA
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Form |
FLAT
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
9.017 mm
|
22.36 mm
|
Base Number Matches |
1
|
2
|
JESD-609 Code |
|
e4
|
Qualification Status |
|
Not Qualified
|
Terminal Finish |
|
GOLD
|
|
|
|
Compare P4C164L-25FILF with alternatives
Compare FTS128K32N-25H3C with alternatives