P4C164L-25DWC vs P4C1256L-70PMBLF feature comparison

P4C164L-25DWC Pyramid Semiconductor Corporation

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P4C1256L-70PMBLF Pyramid Semiconductor Corporation

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Rohs Code No Yes
Part Life Cycle Code Active Active
Ihs Manufacturer PYRAMID SEMICONDUCTOR CORP PYRAMID SEMICONDUCTOR CORP
Part Package Code DIP DIP
Package Description 0.600 INCH, CERAMIC, DIP-28 0.600 INCH, ROHS COMPLIANT, PLASTIC, DIP-28
Pin Count 28 28
Reach Compliance Code compliant compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 70 ns
Additional Feature LG-MAX
JESD-30 Code R-CDIP-T28 R-PDIP-T28
Length 37.846 mm 36.322 mm
Memory Density 65536 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 8192 words 32768 words
Number of Words Code 8000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 8KX8 32KX8
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 5.08 mm 5.08 mm
Supply Current-Max 0.15 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm 15.24 mm
Base Number Matches 2 2
JESD-609 Code e3
Qualification Status Not Qualified
Screening Level MIL-STD-883 Class B
Terminal Finish MATTE TIN

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Compare P4C1256L-70PMBLF with alternatives