P4C164L-25CWC
vs
P4C1256L-70PMBLF
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
PYRAMID SEMICONDUCTOR CORP
PYRAMID SEMICONDUCTOR CORP
Part Package Code
DIP
DIP
Package Description
0.600 INCH, CERAMIC, SIDE BRAZED, DIP-28
0.600 INCH, ROHS COMPLIANT, PLASTIC, DIP-28
Pin Count
28
28
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
70 ns
Additional Feature
LG-MAX
JESD-30 Code
R-CDIP-T28
R-PDIP-T28
Length
37.846 mm
36.322 mm
Memory Density
65536 bit
262144 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
8192 words
32768 words
Number of Words Code
8000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
8KX8
32KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
5.08 mm
5.08 mm
Supply Current-Max
0.15 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
15.24 mm
15.24 mm
Base Number Matches
2
2
JESD-609 Code
e3
Qualification Status
Not Qualified
Screening Level
MIL-STD-883 Class B
Terminal Finish
MATTE TIN
Compare P4C164L-25CWC with alternatives
Compare P4C1256L-70PMBLF with alternatives