P4C164L-25CWC
vs
5962-3829454MYA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
PYRAMID SEMICONDUCTOR CORP
AUSTIN SEMICONDUCTOR INC
Part Package Code
DIP
QFJ
Package Description
0.600 INCH, CERAMIC, SIDE BRAZED, DIP-28
CERAMIC, LCC-32
Pin Count
28
32
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
35 ns
Additional Feature
LG-MAX
JESD-30 Code
R-CDIP-T28
R-CQCC-N32
Length
37.846 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
32
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
8KX8
8KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
QCCN
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
5.08 mm
Supply Current-Max
0.15 mA
0.17 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
15.24 mm
Base Number Matches
2
1
I/O Type
COMMON
JESD-609 Code
e0
Output Characteristics
3-STATE
Package Equivalence Code
LCC32,.45X.55
Qualification Status
Not Qualified
Screening Level
MIL-STD-883
Standby Current-Max
0.02 A
Standby Voltage-Min
4.5 V
Terminal Finish
TIN LEAD
Compare P4C164L-25CWC with alternatives
Compare 5962-3829454MYA with alternatives