P4C164L-12P6I vs FT6164L-12DWMB feature comparison

P4C164L-12P6I Pyramid Semiconductor Corporation

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FT6164L-12DWMB Force Technologies Ltd

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Rohs Code No
Part Life Cycle Code Active Active
Ihs Manufacturer PYRAMID SEMICONDUCTOR CORP FORCE TECHNOLOGIES LTD
Part Package Code DIP DIP
Package Description 0.600 INCH, PLASTIC, DIP-28 DIP,
Pin Count 28 28
Reach Compliance Code compliant compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 12 ns 12 ns
JESD-30 Code R-PDIP-T28 R-GDIP-T28
JESD-609 Code e0
Length 36.322 mm 37.846 mm
Memory Density 65536 bit 65536 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 8KX8 8KX8
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Seated Height-Max 5.08 mm 5.8928 mm
Supply Current-Max 0.18 mA 0.18 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 1 1
Additional Feature LG-MAX
Qualification Status Not Qualified
Screening Level MIL-STD-883

Compare P4C164L-12P6I with alternatives

Compare FT6164L-12DWMB with alternatives