P4C164L-12LSC
vs
P4C164L-12LSMBLF
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
PYRAMID SEMICONDUCTOR CORP
PYRAMID SEMICONDUCTOR CORP
Part Package Code
QLCC
QLCC
Package Description
0.350 X 0.550 INCH, CERAMIC, LCC-28
0.350 X 0.550 INCH, ROHS COMPLIANT, CERAMIC, LCC-28
Pin Count
28
28
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
12 ns
12 ns
JESD-30 Code
R-CQCC-N28
R-CQCC-N28
Length
13.97 mm
13.97 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
8KX8
8KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCN
QCCN
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Seated Height-Max
1.905 mm
1.905 mm
Supply Current-Max
0.17 mA
0.18 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
8.89 mm
8.89 mm
Base Number Matches
1
1
Pbfree Code
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
LCC28,.35X.55
Qualification Status
Not Qualified
Screening Level
MIL-STD-883 Class B
Standby Current-Max
0.0002 A
Standby Voltage-Min
2 V
Compare P4C164L-12LSC with alternatives
Compare P4C164L-12LSMBLF with alternatives