P4C164-70DWMBLF
vs
P4C164L-70L32MLF
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
PYRAMID SEMICONDUCTOR CORP
PYRAMID SEMICONDUCTOR CORP
Part Package Code
DIP
QFJ
Package Description
DIP, DIP28,.6
0.450 X 0.550 INCH, ROHS COMPLIANT, CERAMIC, LCC-32
Pin Count
28
32
Reach Compliance Code
compliant
compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
70 ns
70 ns
Additional Feature
LG-MAX
I/O Type
COMMON
JESD-30 Code
R-CDIP-T28
R-CQCC-N32
Length
37.846 mm
13.97 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
32
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
8KX8
8KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
QCCN
Package Equivalence Code
DIP28,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class B
Seated Height-Max
5.08 mm
1.905 mm
Standby Current-Max
0.025 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.145 mA
0.145 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
15.24 mm
11.43 mm
Base Number Matches
1
1
Compare P4C164-70DWMBLF with alternatives
Compare P4C164L-70L32MLF with alternatives