P4C164-20FI
vs
5962-3829430MMX
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
PYRAMID SEMICONDUCTOR CORP
AUSTIN SEMICONDUCTOR INC
Part Package Code
DFP
DFP
Package Description
DFP,
DFP,
Pin Count
28
28
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
20 ns
20 ns
Additional Feature
LG-MAX
JESD-30 Code
R-CDFP-F28
R-CDFP-F28
Length
18.542 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
8KX8
8KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DFP
DFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
2.286 mm
Supply Current-Max
0.16 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
FLAT
FLAT
Terminal Pitch
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
9.017 mm
Base Number Matches
1
2
Qualification Status
Not Qualified
Compare P4C164-20FI with alternatives
Compare 5962-3829430MMX with alternatives