Findchips: Compare P4C163L-25CMLF vs 5962-8868303YX

P4C163L-25CMLF vs 5962-8868303YX feature comparison

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Pbfree Code	Yes
Rohs Code	Yes
Part Life Cycle Code	Active	Active
Ihs Manufacturer	PYRAMID SEMICONDUCTOR CORP	PYRAMID SEMICONDUCTOR CORP
Part Package Code	DIP	DIP
Package Description	0.300 INCH, ROHS COMPLIANT, CERAMIC, DIP-28	DIP,
Pin Count	28	28
Reach Compliance Code	compliant	compliant
ECCN Code	3A001.A.2.C	3A001.A.2.C
HTS Code	8542.32.00.41	8542.32.00.41
Access Time-Max	25 ns	25 ns
JESD-30 Code	R-CDIP-T28	R-XDIP-T28
Memory Density	73728 bit	73728 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM
Memory Width	9	9
Number of Functions	1	1
Number of Terminals	28	28
Number of Words	8192 words	8192 words
Number of Words Code	8000	8000
Operating Mode	ASYNCHRONOUS	ASYNCHRONOUS
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-55 °C	-55 °C
Organization	8KX9	8KX9
Package Body Material	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED
Package Code	DIP	DIP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL
Peak Reflow Temperature (Cel)	NOT SPECIFIED
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	5.715 mm	5.08 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	4.5 V	4.5 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	NO	NO
Technology	CMOS	CMOS
Temperature Grade	MILITARY	MILITARY
Terminal Form	THROUGH-HOLE	THROUGH-HOLE
Terminal Pitch	2.54 mm	2.54 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	NOT SPECIFIED
Width	7.62 mm	7.62 mm
Base Number Matches	1	1
Screening Level		MIL-STD-883
	Memory » SRAMs	Memory » SRAMs