P4C147-10PC vs P4C147-20DM feature comparison

P4C147-10PC Pyramid Semiconductor Corporation

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P4C147-20DM Pyramid Semiconductor Corporation

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Active Active
Ihs Manufacturer PYRAMID SEMICONDUCTOR CORP PYRAMID SEMICONDUCTOR CORP
Part Package Code DIP DIP
Package Description DIP, DIP18,.3 DIP, DIP18,.3
Pin Count 18 18
Reach Compliance Code compliant compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 10 ns 20 ns
I/O Type SEPARATE SEPARATE
JESD-30 Code R-PDIP-T18 R-GDIP-T18
JESD-609 Code e0 e0
Length 22.86 mm
Memory Density 4096 bit 4096 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 1 1
Number of Functions 1 1
Number of Terminals 18 18
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 4KX1 4KX1
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP18,.3 DIP18,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.334 mm 5.08 mm
Standby Current-Max 0.01 A 0.015 A
Standby Voltage-Min 4.5 V 4.5 V
Supply Current-Max 0.13 mA 0.135 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1

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