P4C1256-20TI
vs
5962-9318709HXX
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
PYRAMID SEMICONDUCTOR CORP
WHITE MICROELECTRONICS
Part Package Code
TSOP
Package Description
8 X 13.40 MM, PLASTIC, TSOP-28
Pin Count
28
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
20 ns
20 ns
JESD-30 Code
R-PDSO-G28
S-CHIP-P66
JESD-609 Code
e0
Length
11.811 mm
Memory Density
262144 bit
4194304 bit
Memory IC Type
STANDARD SRAM
SRAM MODULE
Memory Width
8
16
Number of Functions
1
1
Number of Terminals
28
66
Number of Words
32768 words
262144 words
Number of Words Code
32000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
32KX8
256K16
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
TSOP1
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, THIN PROFILE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1938 mm
Supply Current-Max
0.165 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
PIN/PEG
Terminal Pitch
0.55 mm
Terminal Position
DUAL
HEX
Width
8.001 mm
Base Number Matches
1
3
Additional Feature
USER CONFIGURABLE AS 128K X 32
Alternate Memory Width
8
Screening Level
MIL-PRF-38535
Compare P4C1256-20TI with alternatives
Compare 5962-9318709HXX with alternatives