P4C1024L-55SI vs CXK58256P-12L feature comparison

P4C1024L-55SI Pyramid Semiconductor Corporation

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CXK58256P-12L Sony Semiconductor

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Active
Ihs Manufacturer PERFORMANCE SEMICONDUCTOR CORP SONY CORP
Part Package Code SOIC
Package Description SOP, SOP32,.56
Pin Count 32
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.41
Access Time-Max 55 ns 120 ns
I/O Type COMMON COMMON
JESD-30 Code R-PDSO-G32 R-PDIP-T28
JESD-609 Code e0 e0
Length 20.447 mm
Memory Density 1048576 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1
Number of Ports 1
Number of Terminals 32 28
Number of Words 131072 words 32768 words
Number of Words Code 128000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 128KX8 32KX8
Output Characteristics 3-STATE 3-STATE
Output Enable YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Equivalence Code SOP32,.56 DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.9972 mm
Standby Current-Max 0.00003 A 0.0001 A
Standby Voltage-Min 2 V 2 V
Supply Current-Max 0.085 mA 0.04 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 11.303 mm
Base Number Matches 1 1
Power Supplies 5 V

Compare P4C1024L-55SI with alternatives

Compare CXK58256P-12L with alternatives