P4C1024L-55SC
vs
P4C1256L-55DC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
PERFORMANCE SEMICONDUCTOR CORP
PYRAMID SEMICONDUCTOR CORP
Part Package Code
SOIC
DIP
Package Description
SOP, SOP32,.56
DIP,
Pin Count
32
28
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.41
Access Time-Max
55 ns
55 ns
I/O Type
COMMON
JESD-30 Code
R-PDSO-G32
R-CDIP-T28
JESD-609 Code
e0
e0
Length
20.447 mm
37.719 mm
Memory Density
1048576 bit
262144 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Ports
1
Number of Terminals
32
28
Number of Words
131072 words
32768 words
Number of Words Code
128000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
128KX8
32KX8
Output Characteristics
3-STATE
Output Enable
YES
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
SOP
DIP
Package Equivalence Code
SOP32,.56
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.9972 mm
5.715 mm
Standby Current-Max
0.00003 A
Standby Voltage-Min
2 V
Supply Current-Max
0.07 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
11.303 mm
7.62 mm
Base Number Matches
3
4
Additional Feature
LG-MAX
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare P4C1024L-55SC with alternatives
Compare P4C1256L-55DC with alternatives