P3C1011-12JI
vs
IS62US12816SL-100HI
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
PYRAMID SEMICONDUCTOR CORP
|
INTEGRATED SILICON SOLUTION INC
|
| Part Package Code |
SOJ
|
TSOP2
|
| Package Description |
0.400 INCH, PLASTIC, SOJ-44
|
STSOP2-44
|
| Pin Count |
44
|
44
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
12 ns
|
100 ns
|
| JESD-30 Code |
R-PDSO-J44
|
R-PDSO-G44
|
| JESD-609 Code |
e0
|
e0
|
| Length |
28.575 mm
|
18.41 mm
|
| Memory Density |
2097152 bit
|
2097152 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
44
|
44
|
| Number of Words |
131072 words
|
131072 words
|
| Number of Words Code |
128000
|
128000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
128KX16
|
128KX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOJ
|
TSOP2
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.759 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
2.2 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
1.8 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
J BEND
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.8 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
10.16 mm
|
10.16 mm
|
| Base Number Matches |
1
|
1
|
| Moisture Sensitivity Level |
|
3
|
|
|
|
Compare P3C1011-12JI with alternatives
Compare IS62US12816SL-100HI with alternatives