P21010-07 vs KM41C1000AP-7 feature comparison

P21010-07 Intel Corporation

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KM41C1000AP-7 Samsung Semiconductor

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer INTEL CORP SAMSUNG SEMICONDUCTOR INC
Part Package Code DIP
Package Description DIP, DIP18,.3
Pin Count 18
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.32.00.02
Access Mode FAST PAGE
Access Time-Max 70 ns 70 ns
Additional Feature RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O Type SEPARATE SEPARATE
JESD-30 Code R-PDIP-T18 R-PDIP-T18
JESD-609 Code e0 e0
Length 21.965 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type FAST PAGE DRAM FAST PAGE DRAM
Memory Width 1 1
Number of Functions 1
Number of Ports 1
Number of Terminals 18 18
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX1 1MX1
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP18,.3 DIP18,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Refresh Cycles 512 512
Seated Height-Max 5.0038 mm
Standby Current-Max 0.001 A 0.001 A
Supply Current-Max 0.08 mA 0.08 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Power Supplies 5 V
Time@Peak Reflow Temperature-Max (s) 40

Compare P21010-07 with alternatives

Compare KM41C1000AP-7 with alternatives