P1AFS600-2FGG484
vs
M1AFS600-1FGG484YK
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
FBGA-484
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.D
HTS Code
8542.31.00.01
8542.39.00.01
Factory Lead Time
16 Weeks
JESD-30 Code
S-PBGA-B484
JESD-609 Code
e1
e1
Length
23 mm
Moisture Sensitivity Level
3
3
Number of CLBs
13824
Number of Equivalent Gates
600000
Number of Terminals
484
Operating Temperature-Max
85 °C
Operating Temperature-Min
Organization
13824 CLBS, 600000 GATES
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY
Packing Method
TRAY
Peak Reflow Temperature (Cel)
250
250
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Seated Height-Max
2.44 mm
Supply Voltage-Max
1.575 V
Supply Voltage-Min
1.425 V
Supply Voltage-Nom
1.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
OTHER
Terminal Finish
TIN SILVER COPPER
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
23 mm
Base Number Matches
3
3
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