P1750AE-30CMB vs MC68000P12F feature comparison

P1750AE-30CMB Pyramid Semiconductor Corporation

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MC68000P12F Motorola Semiconductor Products

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer PYRAMID SEMICONDUCTOR CORP MOTOROLA INC
Part Package Code DIP
Package Description BRAZED, DIP-64 PLASTIC, DIP-64
Pin Count 64
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 16 23
Bit Size 16 32
Boundary Scan NO NO
Clock Frequency-Max 30 MHz 16.67 MHz
External Data Bus Width 16 16
Format FLOATING POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code R-XDIP-T64 R-PDIP-T64
Length 42.2402 mm 81.535 mm
Low Power Mode NO NO
Number of Terminals 64 64
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.191 mm 5.84 mm
Speed 30 MHz 16.67 MHz
Supply Voltage-Max 5.5 V 5.25 V
Supply Voltage-Min 4.5 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm 22.86 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 1 1
JESD-609 Code e0
Number of DMA Channels
Number of External Interrupts 7
Number of Serial I/Os
On Chip Data RAM Width
Package Equivalence Code DIP64,.9
RAM (words) 0
Supply Current-Max 50 mA
Terminal Finish TIN LEAD

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