P1014NXN5DFB
vs
P1014NXE5DFA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
19 X 19 MM, 1.90 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, PLASTIC, TEPBGA-425
19 X 19 MM, 1.90 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, PLASTIC, TEPBGA-425
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
5A002.A
HTS Code
8542.31.00.01
8542.31.00.01
Samacsys Manufacturer
NXP
Address Bus Width
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
100 MHz
100 MHz
External Data Bus Width
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B425
S-PBGA-B425
JESD-609 Code
e2
e2
Length
19 mm
19 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
3
Number of Terminals
425
425
Operating Temperature-Max
105 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FBGA
FBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, FINE PITCH
GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel)
260
Seated Height-Max
1.9 mm
1.9 mm
Speed
533 MHz
533 MHz
Supply Voltage-Max
1.05 V
1.05 V
Supply Voltage-Min
0.95 V
0.95 V
Supply Voltage-Nom
1 V
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
Tin/Silver (Sn/Ag)
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
19 mm
19 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Compare P1014NXN5DFB with alternatives
Compare P1014NXE5DFA with alternatives