P1014NXE5HHB
vs
P1014NSE5HHB
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Package Description |
FBGA,
|
19 X 19 MM, 1.90 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, PLASTIC, TEPBGA-425
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
5A002.A.1
|
5A002.A.1
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
|
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
100 MHz
|
100 MHz
|
| External Data Bus Width |
|
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B425
|
S-PBGA-B425
|
| JESD-609 Code |
e2
|
e2
|
| Length |
19 mm
|
19 mm
|
| Low Power Mode |
YES
|
YES
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Terminals |
425
|
425
|
| Operating Temperature-Max |
105 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FBGA
|
FBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
1.9 mm
|
1.9 mm
|
| Speed |
800 MHz
|
800 MHz
|
| Supply Voltage-Max |
1.05 V
|
1.05 V
|
| Supply Voltage-Min |
0.95 V
|
0.95 V
|
| Supply Voltage-Nom |
1 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
Tin/Silver (Sn/Ag)
|
Tin/Silver (Sn/Ag)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
19 mm
|
19 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
1
|
| Samacsys Manufacturer |
|
NXP
|
|
|
|
Compare P1014NXE5HHB with alternatives
Compare P1014NSE5HHB with alternatives