ORSPI4-3FN1156C vs LFE2M50SE-6F900I feature comparison

ORSPI4-3FN1156C Lattice Semiconductor Corporation

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LFE2M50SE-6F900I Lattice Semiconductor Corporation

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LATTICE SEMICONDUCTOR CORP LATTICE SEMICONDUCTOR CORP
Part Package Code BGA BGA
Package Description 35 X 35 MM, LEAD FREE, FPBGA-1156 FPBGA-900
Pin Count 1156 900
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 185 MHz 357 MHz
JESD-30 Code S-PBGA-B1156 S-PBGA-B900
JESD-609 Code e1 e0
Length 35 mm 31 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2024
Number of Equivalent Gates 471000
Number of Terminals 1156 900
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2024 CLBS, 471000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 3.6 V 1.26 V
Supply Voltage-Min 3 V 1.14 V
Supply Voltage-Nom 3.3 V 1.2 V
Surface Mount YES YES
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 30
Width 35 mm 31 mm
Base Number Matches 1 1
Pbfree Code No
ECCN Code 3A991.D
Combinatorial Delay of a CLB-Max 0.331 ns
Number of Inputs 410
Number of Logic Cells 50000
Number of Outputs 410
Package Equivalence Code BGA900,30X30,40

Compare ORSPI4-3FN1156C with alternatives

Compare LFE2M50SE-6F900I with alternatives