ORSPI4-3F1156C
vs
ORSPI4-3FN1156C
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
LATTICE SEMICONDUCTOR CORP
|
LATTICE SEMICONDUCTOR CORP
|
Part Package Code |
BGA
|
BGA
|
Package Description |
35 X 35 MM, FPBGA-1156
|
35 X 35 MM, LEAD FREE, FPBGA-1156
|
Pin Count |
1156
|
1156
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
185 MHz
|
185 MHz
|
JESD-30 Code |
S-PBGA-B1156
|
S-PBGA-B1156
|
JESD-609 Code |
e0
|
e1
|
Length |
35 mm
|
35 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
2024
|
2024
|
Number of Equivalent Gates |
471000
|
471000
|
Number of Terminals |
1156
|
1156
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
2024 CLBS, 471000 GATES
|
2024 CLBS, 471000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
225
|
250
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.6 mm
|
2.6 mm
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
Width |
35 mm
|
35 mm
|
Base Number Matches |
2
|
1
|
|
|
|
Compare ORSPI4-3F1156C with alternatives
Compare ORSPI4-3FN1156C with alternatives