ORSPI4-1F1156C
vs
LFE2M50E-6FN900C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
LATTICE SEMICONDUCTOR CORP
LATTICE SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
35 X 35 MM, FPBGA-1156
FPBGA-900
Pin Count
1156
900
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
185 MHz
357 MHz
JESD-30 Code
S-PBGA-B1156
S-PBGA-B900
JESD-609 Code
e0
e1
Length
35 mm
31 mm
Moisture Sensitivity Level
3
3
Number of CLBs
2024
6000
Number of Equivalent Gates
471000
Number of Terminals
1156
900
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
2024 CLBS, 471000 GATES
6000 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
250
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.6 mm
2.6 mm
Supply Voltage-Max
3.6 V
1.26 V
Supply Voltage-Min
3 V
1.14 V
Supply Voltage-Nom
3.3 V
1.2 V
Surface Mount
YES
YES
Temperature Grade
AUTOMOTIVE
OTHER
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
40
Width
35 mm
31 mm
Base Number Matches
2
1
Pbfree Code
ECCN Code
3A991.D
Combinatorial Delay of a CLB-Max
0.331 ns
Number of Inputs
410
Number of Logic Cells
50000
Number of Outputs
410
Package Equivalence Code
BGA900,30X30,40
Compare ORSPI4-1F1156C with alternatives
Compare LFE2M50E-6FN900C with alternatives