ORNTA2002DUF vs DFNA2002DT3 feature comparison

ORNTA2002DUF Vishay Intertechnologies

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DFNA2002DT3 Vishay Intertechnologies

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer VISHAY INTERTECHNOLOGY INC VISHAY INTERTECHNOLOGY INC
Package Description CHIP SOIC, ROHS COMPLIANT
Reach Compliance Code compliant unknown
Factory Lead Time 15 Weeks 27 Weeks
Construction Rectangular Rectangular
Element Power Dissipation 0.1 W 0.1 W
First Element Resistance 20000 Ω 20000 Ω
JESD-609 Code e3 e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Network Type ISOLATED ISOLATED
Number of Elements 1 1
Number of Functions 4 4
Number of Terminals 8 8
Operating Temperature-Max 150 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 1.73 mm 0.85 mm
Package Length 4.9 mm 4 mm
Package Shape RECTANGULAR PACKAGE RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 3.9 mm 4 mm
Packing Method Tube TR
Rated Power Dissipation (P) 0.4 W 0.4 W
Rated Temperature 70 °C 70 °C
Resistance 20000 Ω 20000 Ω
Resistor Type ARRAY/NETWORK RESISTOR ARRAY/NETWORK RESISTOR
Second/Last Element Resistance 20000 Ω 20000 Ω
Size Code 1915 1616
Surface Mount YES YES
Technology THIN FILM THIN FILM
Temperature Coefficient 25 ppm/°C 25 ppm/°C
Temperature Coefficient Tracking 5 ppm/°C 3 ppm/°C
Terminal Finish MATTE TIN Matte Tin (Sn)
Terminal Shape GULL WING WRAPAROUND
Tolerance 0.5% 0.5%
Working Voltage 100 V 100 V
Base Number Matches 1 1
Additional Feature PRECISION

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