ORNTA2002DUF
vs
DFNA2002DT3
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Active
Ihs Manufacturer
VISHAY INTERTECHNOLOGY INC
VISHAY INTERTECHNOLOGY INC
Package Description
CHIP
SOIC, ROHS COMPLIANT
Reach Compliance Code
compliant
unknown
Factory Lead Time
15 Weeks
27 Weeks
Construction
Rectangular
Rectangular
Element Power Dissipation
0.1 W
0.1 W
First Element Resistance
20000 Ω
20000 Ω
JESD-609 Code
e3
e3
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Network Type
ISOLATED
ISOLATED
Number of Elements
1
1
Number of Functions
4
4
Number of Terminals
8
8
Operating Temperature-Max
150 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
1.73 mm
0.85 mm
Package Length
4.9 mm
4 mm
Package Shape
RECTANGULAR PACKAGE
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
3.9 mm
4 mm
Packing Method
Tube
TR
Rated Power Dissipation (P)
0.4 W
0.4 W
Rated Temperature
70 °C
70 °C
Resistance
20000 Ω
20000 Ω
Resistor Type
ARRAY/NETWORK RESISTOR
ARRAY/NETWORK RESISTOR
Second/Last Element Resistance
20000 Ω
20000 Ω
Size Code
1915
1616
Surface Mount
YES
YES
Technology
THIN FILM
THIN FILM
Temperature Coefficient
25 ppm/°C
25 ppm/°C
Temperature Coefficient Tracking
5 ppm/°C
3 ppm/°C
Terminal Finish
MATTE TIN
Matte Tin (Sn)
Terminal Shape
GULL WING
WRAPAROUND
Tolerance
0.5%
0.5%
Working Voltage
100 V
100 V
Base Number Matches
1
1
Additional Feature
PRECISION
Compare ORNTA2002DUF with alternatives
Compare DFNA2002DT3 with alternatives