OR3T557PS240-DB
vs
OR3T556PS240-DB
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
LATTICE SEMICONDUCTOR CORP
|
ROCHESTER ELECTRONICS INC
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
PLASTIC, SQFP2-240
|
HFQFP,
|
| Pin Count |
240
|
240
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Clock Frequency-Max |
885 MHz
|
|
| Combinatorial Delay of a CLB-Max |
1.05 ns
|
1.32 ns
|
| JESD-30 Code |
S-PQFP-G240
|
S-PQFP-G240
|
| JESD-609 Code |
e0
|
|
| Length |
32 mm
|
32 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
324
|
324
|
| Number of Equivalent Gates |
80000
|
80000
|
| Number of Inputs |
188
|
|
| Number of Logic Cells |
2592
|
|
| Number of Outputs |
188
|
|
| Number of Terminals |
240
|
240
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
324 CLBS, 80000 GATES
|
324 CLBS, 80000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HFQFP
|
HFQFP
|
| Package Equivalence Code |
HQFP240,1.37SQ,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, HEAT SINK/SLUG, FINE PITCH
|
FLATPACK, HEAT SINK/SLUG, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
225
|
225
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
COMMERCIAL
|
| Seated Height-Max |
4.1 mm
|
4.1 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
NOT SPECIFIED
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
32 mm
|
32 mm
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
No
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare OR3T557PS240-DB with alternatives