OR3T556BA352I-DB
vs
OR3T556BA352-DB
feature comparison
| Pbfree Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
LATTICE SEMICONDUCTOR CORP
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
PLASTIC, BGA-352
|
PLASTIC, BGA-352
|
| Pin Count |
352
|
352
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| Combinatorial Delay of a CLB-Max |
1.32 ns
|
1.32 ns
|
| JESD-30 Code |
S-PBGA-B352
|
S-PBGA-B352
|
| Length |
35 mm
|
35 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
324
|
324
|
| Number of Equivalent Gates |
80000
|
80000
|
| Number of Terminals |
352
|
352
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
324 CLBS, 80000 GATES
|
324 CLBS, 80000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
225
|
225
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Seated Height-Max |
2.54 mm
|
2.54 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
NOT SPECIFIED
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
35 mm
|
35 mm
|
| Base Number Matches |
2
|
1
|
| Rohs Code |
|
No
|
| HTS Code |
|
8542.39.00.01
|
| Clock Frequency-Max |
|
694.4 MHz
|
| Number of Inputs |
|
284
|
| Number of Logic Cells |
|
2592
|
| Number of Outputs |
|
284
|
| Package Equivalence Code |
|
BGA352,26X26,50
|
| Technology |
|
CMOS
|
|
|
|
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