ONET8541TY
vs
M02013-QSPBG
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MINDSPEED TECHNOLOGIES INC
|
| Part Package Code |
DIE
|
DIE
|
| Package Description |
DIE-18
|
DIE, DIE OR CHIP
|
| Pin Count |
18
|
12
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
Data rate is 11.3 Gbps
|
|
| Applications |
SONET
|
ATM; SDH; SONET
|
| JESD-30 Code |
R-XUUC-N18
|
R-XUUC-N12
|
| Length |
1.036 mm
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
18
|
12
|
| Operating Temperature-Max |
100 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
DIE
|
DIE
|
| Package Equivalence Code |
DIE OR CHIP
|
DIE OR CHIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
UNCASED CHIP
|
UNCASED CHIP
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max |
40 mA
|
0.058 mA
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ATM/SONET/SDH SUPPORT CIRCUIT
|
ATM/SONET/SDH SUPPORT CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
UPPER
|
UPPER
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
0.87 mm
|
|
| Base Number Matches |
2
|
1
|
| Technology |
|
CMOS
|
|
|
|
Compare ONET8541TY with alternatives
Compare M02013-QSPBG with alternatives