ONET8501PBRGTT
vs
HMC914LP4ETR
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
HITTITE MICROWAVE CORP
|
| Part Package Code |
QFN
|
|
| Package Description |
3 X 3 MM, 0.50 MM PITCH, GREEN, PLASTIC, QFN-16
|
HVQCCN,
|
| Pin Count |
16
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
5A991.B.1
|
|
| HTS Code |
8542.33.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
|
| Data Rate |
11300000 Mbps
|
|
| JESD-30 Code |
S-PQCC-N16
|
S-PQCC-N24
|
| JESD-609 Code |
e4
|
|
| Length |
3 mm
|
4 mm
|
| Moisture Sensitivity Level |
2
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
24
|
| Operating Temperature-Max |
100 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Supply Current-Max |
63 mA
|
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
TELECOM CIRCUIT
|
TELECOM CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
3 mm
|
4 mm
|
| Base Number Matches |
1
|
2
|
|
|
|
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