OMAPL138EZCEA3
vs
OMAPL138EZCE4
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
NFBGA-361
|
LFBGA,
|
Pin Count |
361
|
361
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
Additional Feature |
IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY
|
IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY
|
Address Bus Width |
23
|
23
|
Barrel Shifter |
NO
|
NO
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
50 MHz
|
50 MHz
|
External Data Bus Width |
16
|
16
|
Format |
FLOATING POINT
|
FLOATING POINT
|
Integrated Cache |
YES
|
YES
|
Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
JESD-30 Code |
S-PBGA-B361
|
S-PBGA-B361
|
JESD-609 Code |
e1
|
e1
|
Length |
13 mm
|
13 mm
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
3
|
3
|
Number of DMA Channels |
64
|
64
|
Number of Serial I/Os |
3
|
3
|
Number of Terminals |
361
|
361
|
Number of Timers |
4
|
4
|
On Chip Data RAM Width |
8
|
8
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
105 °C
|
90 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFBGA
|
Package Equivalence Code |
BGA361,19X19,25
|
BGA361,19X19,25
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
RAM (words) |
499712
|
499712
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
1.3 mm
|
1.3 mm
|
Supply Voltage-Max |
1.35 V
|
1.35 V
|
Supply Voltage-Min |
1.25 V
|
1.25 V
|
Supply Voltage-Nom |
1.3 V
|
1.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
OTHER
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
13 mm
|
13 mm
|
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
Base Number Matches |
3
|
1
|
|
|
|
Compare OMAPL138EZCEA3 with alternatives
Compare OMAPL138EZCE4 with alternatives