OMAPL137DZKB4
vs
OMAPL137DZKBT3
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Package Description
BGA-256
BGA-256
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Samacsys Manufacturer
Texas Instruments
Texas Instruments
Address Bus Width
15
15
Barrel Shifter
NO
NO
Bit Size
16
16
Boundary Scan
YES
YES
Clock Frequency-Max
30 MHz
30 MHz
External Data Bus Width
16
16
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
Internal Bus Architecture
SINGLE
SINGLE
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e1
e1
Length
17 mm
17 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
3
Number of DMA Channels
40
40
Number of Terminals
256
256
Number of Timers
3
3
On Chip Data RAM Width
8
8
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA256,16X16,40
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
RAM (words)
499712
499712
Seated Height-Max
2.05 mm
2.05 mm
Speed
456 MHz
456 MHz
Supply Voltage-Max
1.35 V
1.32 V
Supply Voltage-Min
1.25 V
1.14 V
Supply Voltage-Nom
1.3 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
17 mm
17 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, OTHER
DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches
1
1
Compare OMAPL137DZKB4 with alternatives
Compare OMAPL137DZKBT3 with alternatives