OMAP5912ZZG vs OMAP5912ZDY feature comparison

OMAP5912ZZG Texas Instruments

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OMAP5912ZDY Texas Instruments

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Rohs Code Yes No
Part Life Cycle Code Obsolete Not Recommended
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code BGA BGA
Package Description MICRO BGA-289 BGA, BGA289,17X17,40
Pin Count 289 289
Reach Compliance Code compliant compliant
ECCN Code 5A992.C 5A992.C
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature ALSO REQUIRES 2.75V OR 3.3V SUPPLY ALSO REQUIRES 2.75V OR 3.3V SUPPLY
Address Bus Width 26 26
Barrel Shifter NO NO
Bit Size 16 16
Boundary Scan YES YES
Clock Frequency-Max 19.2 MHz 19.2 MHz
External Data Bus Width 16 16
Format FIXED POINT FIXED POINT
Integrated Cache YES YES
Internal Bus Architecture MULTIPLE MULTIPLE
JESD-30 Code S-PBGA-B289 S-PBGA-B289
JESD-609 Code e1 e1
Length 12 mm 19 mm
Low Power Mode YES YES
Moisture Sensitivity Level 4 3
Number of DMA Channels 6 6
Number of Terminals 289 289
Number of Timers 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA BGA
Package Equivalence Code BGA289,21X21,20 BGA289,17X17,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
RAM (words) 163840 163840
Seated Height-Max 1.2 mm 2.32 mm
Supply Voltage-Max 1.65 V 1.65 V
Supply Voltage-Min 1.525 V 1.525 V
Supply Voltage-Nom 1.6 V 1.6 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 12 mm 19 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, MIXED DIGITAL SIGNAL PROCESSOR, MIXED
Base Number Matches 1 3
Speed 192 MHz