OMAP3530DZCBBA
vs
XAM3715CBC
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
VFBGA, BGA515,28X28,16
|
HBGA,
|
| Pin Count |
515
|
515
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
26
|
16
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
59 MHz
|
38.4 MHz
|
| External Data Bus Width |
16
|
16
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B515
|
S-PBGA-B515
|
| JESD-609 Code |
e1
|
|
| Length |
12 mm
|
14 mm
|
| Low Power Mode |
YES
|
YES
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
515
|
515
|
| Operating Temperature-Max |
105 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
HBGA
|
| Package Equivalence Code |
BGA515,28X28,16
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, HEAT SINK/SLUG
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.9 mm
|
1 mm
|
| Speed |
600 MHz
|
1000 MHz
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.4 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
12 mm
|
14 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare OMAP3530DZCBBA with alternatives
Compare XAM3715CBC with alternatives