OMAP3515ECBB
vs
OMAP3503ECBC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Not Recommended
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
TEXAS INSTRUMENTS INC
Part Package Code
BGA
BGA
Package Description
POPFCBGA-515
POPFCBGA-515
Pin Count
515
515
Reach Compliance Code
compliant
compliant
ECCN Code
5A992.C
5A992.C
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
15
Barrel Shifter
NO
NO
Bit Size
32
Boundary Scan
YES
YES
Clock Frequency-Max
59 MHz
59 MHz
External Data Bus Width
16
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
Internal Bus Architecture
SINGLE
SINGLE
JESD-30 Code
S-PBGA-B515
S-PBGA-B515
JESD-609 Code
e1
e1
Length
12 mm
12 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
3
Number of DMA Channels
32
32
Number of Terminals
515
515
Number of Timers
15
15
On Chip Data RAM Width
32
32
On Chip Program ROM Width
32
32
Operating Temperature-Max
90 °C
90 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
VFBGA
Package Equivalence Code
BGA515,28X28,16
BGA515,26X26,20
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
RAM (words)
32768
32768
ROM Programmability
MROM
MROM
Seated Height-Max
0.9 mm
0.9 mm
Speed
720 MHz
Supply Voltage-Max
1.91 V
1.91 V
Supply Voltage-Min
1.71 V
1.71 V
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.4 mm
0.4 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
12 mm
12 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, OTHER
DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches
1
1
Pbfree Code
Compare OMAP3515ECBB with alternatives
Compare OMAP3503ECBC with alternatives