NZX9V1B,133
vs
TZX9V1B-AP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
MICRO COMMERCIAL COMPONENTS CORP
Part Package Code
AXIAL
DO-35
Package Description
HERMETIC SEALED, GLASS, SC-40, 2 PIN
ROHS COMPLIANT, GLASS PACKAGE-2
Pin Count
2
2
Manufacturer Package Code
SOD27
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.80
8541.10.00.50
Factory Lead Time
4 Weeks
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
20 Ω
JESD-30 Code
O-GALF-W2
O-LALF-W2
JESD-609 Code
e3
e3
Moisture Sensitivity Level
1
1
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Package Body Material
CERAMIC, GLASS-SEALED
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
260
260
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
8.9 V
8.9 V
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN
MATTE TIN
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Time@Peak Reflow Temperature-Max (s)
30
10
Voltage Tol-Max
2.25%
2.25%
Working Test Current
5 mA
5 mA
Base Number Matches
2
1
Pbfree Code
JEDEC-95 Code
DO-35
Compare NZX9V1B,133 with alternatives
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