NX3L2G384GM
vs
NX3L2G384GT
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
QFN
|
SON
|
Package Description |
VQCCN, LCC8,.06SQ,20
|
1 X 1.95 MM, 0.50 MM PITCH, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT833-1, XSON-8
|
Pin Count |
8
|
8
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog IC - Other Type |
SPST
|
SPST
|
JESD-30 Code |
S-PQCC-N8
|
R-PDSO-N8
|
JESD-609 Code |
e4
|
e4
|
Length |
1.6 mm
|
1.95 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Channels |
1
|
1
|
Number of Functions |
2
|
2
|
Number of Terminals |
8
|
8
|
Off-state Isolation-Nom |
90 dB
|
90 dB
|
On-state Resistance Match-Nom |
0.04 Ω
|
0.04 Ω
|
On-state Resistance-Max (Ron) |
1.7 Ω
|
1.7 Ω
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VQCCN
|
VSON
|
Package Equivalence Code |
LCC8,.06SQ,20
|
SOLCC8,.04,20
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, VERY THIN PROFILE
|
SMALL OUTLINE, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.5 mm
|
0.5 mm
|
Supply Voltage-Max (Vsup) |
4.3 V
|
4.3 V
|
Supply Voltage-Min (Vsup) |
1.4 V
|
1.4 V
|
Supply Voltage-Nom (Vsup) |
1.65 V
|
1.65 V
|
Surface Mount |
YES
|
YES
|
Switch-off Time-Max |
21 ns
|
21 ns
|
Switch-on Time-Max |
48 ns
|
48 ns
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
1.6 mm
|
1 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare NX3L2G384GM with alternatives
Compare NX3L2G384GT with alternatives