NX3L2G384GD,125
vs
NX3L2G384GM,125
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SON
|
QFN
|
| Package Description |
SON, SOLCC8,.12,20
|
|
| Pin Count |
8
|
8
|
| Manufacturer Package Code |
SOT996-2
|
SOT902-2
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-PDSO-N8
|
S-PQCC-N8
|
| JESD-609 Code |
e4
|
e4
|
| Moisture Sensitivity Level |
1
|
1
|
| Normal Position |
NC
|
NC
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
8
|
| On-state Resistance-Max (Ron) |
4.1 Ω
|
4.1 Ω
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output |
SEPARATE OUTPUT
|
SEPARATE OUTPUT
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SON
|
QCCN
|
| Package Equivalence Code |
SOLCC8,.12,20
|
LCC8,.06SQ,20
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Switch-on Time-Max |
41 ns
|
41 ns
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Base Number Matches |
1
|
1
|
| Factory Lead Time |
|
18 Weeks
|
| Samacsys Manufacturer |
|
NXP
|
|
|
|
Compare NX3L2G384GD,125 with alternatives
Compare NX3L2G384GM,125 with alternatives