NX3L1G3157GW-Q100 vs NX3L1G3157GM,115 feature comparison

NX3L1G3157GW-Q100 NXP Semiconductors

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NX3L1G3157GM,115 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description TSSOP,
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SPDT SPDT
JESD-30 Code R-PDSO-G6 R-PDSO-N6
Length 2 mm 1.45 mm
Number of Channels 1 1
Number of Functions 1 1
Number of Terminals 6 6
Off-state Isolation-Nom 90 dB 90 dB
On-state Resistance Match-Nom 0.04 Ω 0.2 Ω
On-state Resistance-Max (Ron) 4.1 Ω 1.7 Ω
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP VSON
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE
Screening Level AEC-Q100
Seated Height-Max 1.1 mm 0.5 mm
Supply Voltage-Max (Vsup) 4.3 V 4.3 V
Supply Voltage-Min (Vsup) 1.4 V 1.4 V
Supply Voltage-Nom (Vsup) 1.5 V 1.65 V
Surface Mount YES YES
Switch-off Time-Max 30 ns 30 ns
Switch-on Time-Max 52 ns 52 ns
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL DUAL
Width 1.25 mm 1 mm
Base Number Matches 1 1
Part Package Code SON
Pin Count 6
Manufacturer Package Code SOT886
Samacsys Manufacturer NXP
JESD-609 Code e3
Moisture Sensitivity Level 1
Package Equivalence Code SOLCC6,.04,20
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Switching BREAK-BEFORE-MAKE
Terminal Finish Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 30

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Compare NX3L1G3157GM,115 with alternatives