NX3L1G3157GW-Q100
vs
NX3L1G3157GM,115
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Package Description |
TSSOP,
|
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog IC - Other Type |
SPDT
|
SPDT
|
JESD-30 Code |
R-PDSO-G6
|
R-PDSO-N6
|
Length |
2 mm
|
1.45 mm
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
6
|
6
|
Off-state Isolation-Nom |
90 dB
|
90 dB
|
On-state Resistance Match-Nom |
0.04 Ω
|
0.2 Ω
|
On-state Resistance-Max (Ron) |
4.1 Ω
|
1.7 Ω
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
VSON
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, VERY THIN PROFILE
|
Screening Level |
AEC-Q100
|
|
Seated Height-Max |
1.1 mm
|
0.5 mm
|
Supply Voltage-Max (Vsup) |
4.3 V
|
4.3 V
|
Supply Voltage-Min (Vsup) |
1.4 V
|
1.4 V
|
Supply Voltage-Nom (Vsup) |
1.5 V
|
1.65 V
|
Surface Mount |
YES
|
YES
|
Switch-off Time-Max |
30 ns
|
30 ns
|
Switch-on Time-Max |
52 ns
|
52 ns
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
0.65 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
1.25 mm
|
1 mm
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
SON
|
Pin Count |
|
6
|
Manufacturer Package Code |
|
SOT886
|
Samacsys Manufacturer |
|
NXP
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
1
|
Package Equivalence Code |
|
SOLCC6,.04,20
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
Not Qualified
|
Switching |
|
BREAK-BEFORE-MAKE
|
Terminal Finish |
|
Tin (Sn)
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare NX3L1G3157GW-Q100 with alternatives
Compare NX3L1G3157GM,115 with alternatives