NX3L1G3157GMZ
vs
NX3L1G3157GW-Q100
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Reach Compliance Code |
compliant
|
compliant
|
| Factory Lead Time |
4 Weeks
|
|
| Analog IC - Other Type |
SPDT
|
SPDT
|
| Moisture Sensitivity Level |
1
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
TSSOP,
|
| HTS Code |
|
8542.39.00.01
|
| JESD-30 Code |
|
R-PDSO-G6
|
| Length |
|
2 mm
|
| Number of Channels |
|
1
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
6
|
| Off-state Isolation-Nom |
|
90 dB
|
| On-state Resistance Match-Nom |
|
0.04 Ω
|
| On-state Resistance-Max (Ron) |
|
4.1 Ω
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSSOP
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Screening Level |
|
AEC-Q100
|
| Seated Height-Max |
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
|
4.3 V
|
| Supply Voltage-Min (Vsup) |
|
1.4 V
|
| Supply Voltage-Nom (Vsup) |
|
1.5 V
|
| Surface Mount |
|
YES
|
| Switch-off Time-Max |
|
30 ns
|
| Switch-on Time-Max |
|
52 ns
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
DUAL
|
| Width |
|
1.25 mm
|
|
|
|
Compare NX3L1G3157GMZ with alternatives
Compare NX3L1G3157GW-Q100 with alternatives