NX3L1G3157GMZ
vs
NX3L1G3157GW-Q100
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Reach Compliance Code
compliant
compliant
Factory Lead Time
16 Weeks
Analog IC - Other Type
SPDT
SPDT
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Base Number Matches
1
1
Package Description
TSSOP,
HTS Code
8542.39.00.01
JESD-30 Code
R-PDSO-G6
Length
2 mm
Number of Channels
1
Number of Functions
1
Number of Terminals
6
Off-state Isolation-Nom
90 dB
On-state Resistance Match-Nom
0.04 Ω
On-state Resistance-Max (Ron)
4.1 Ω
Operating Temperature-Max
125 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
Package Code
TSSOP
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Screening Level
AEC-Q100
Seated Height-Max
1.1 mm
Supply Voltage-Max (Vsup)
4.3 V
Supply Voltage-Min (Vsup)
1.4 V
Supply Voltage-Nom (Vsup)
1.5 V
Surface Mount
YES
Switch-off Time-Max
30 ns
Switch-on Time-Max
52 ns
Technology
CMOS
Temperature Grade
AUTOMOTIVE
Terminal Form
GULL WING
Terminal Pitch
0.65 mm
Terminal Position
DUAL
Width
1.25 mm
Compare NX3L1G3157GMZ with alternatives
Compare NX3L1G3157GW-Q100 with alternatives