NX3DV221GM,115 vs NX3DV221GM feature comparison

NX3DV221GM,115 NXP Semiconductors

Buy Now Datasheet

NX3DV221GM NXP Semiconductors

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code QFN QFN
Package Description 2 X 1.55 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT1049-2, QFN-10 2 X 1.55 MM, 0.50 MM HEIGHT, PLASTIC, MO-255, SOT1049-2, QFN-10
Pin Count 10 10
Manufacturer Package Code SOT1049-2
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 24 Weeks, 5 Days
Samacsys Manufacturer NXP NXP
JESD-30 Code R-PQCC-N10 R-PQCC-N10
JESD-609 Code e3 e4
Length 2 mm 2 mm
Moisture Sensitivity Level 1 1
Number of Channels 6 6
Number of Functions 1 1
Number of Terminals 10 10
Off-state Isolation-Nom 38 dB 38 dB
On-state Resistance Match-Nom 0.1 Ω 0.1 Ω
On-state Resistance-Max (Ron) 7 Ω 7 Ω
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output SEPARATE OUTPUT
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VQCCN VQCCN
Package Equivalence Code LCC10,.06X.08,20
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER, VERY THIN PROFILE CHIP CARRIER, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified
Seated Height-Max 0.5 mm 0.5 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Switch-off Time-Max 23 ns 23 ns
Switch-on Time-Max 50 ns 50 ns
Switching BREAK-BEFORE-MAKE
Technology CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn) NICKEL PALLADIUM GOLD
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.58 mm 0.58 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.55 mm 1.55 mm
Base Number Matches 1 3
Analog IC - Other Type DIFFERENTIAL MULTIPLEXER

Compare NX3DV221GM,115 with alternatives

Compare NX3DV221GM with alternatives