NX25P16VSI vs W25X16VSFI feature comparison

NX25P16VSI Winbond Electronics Corp

Buy Now Datasheet

W25X16VSFI Winbond Electronics Corp

Buy Now Datasheet
Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP WINBOND ELECTRONICS CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP, SOP16,.4
Pin Count 8 16
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 25 MHz 33 MHz
Data Retention Time-Min 20 20
Endurance 100000 Write/Erase Cycles 100000 Write/Erase Cycles
JESD-30 Code S-PDSO-G8 R-PDSO-G16
JESD-609 Code e0 e0
Length 5.27 mm 10.285 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 16
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX8 2MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP8,.3 SOP16,.4
Package Shape SQUARE RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial SERIAL SERIAL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.16 mm 2.64 mm
Serial Bus Type SPI SPI
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Type NOR TYPE NOR TYPE
Width 5.27 mm 7.49 mm
Write Protection HARDWARE/SOFTWARE HARDWARE/SOFTWARE
Base Number Matches 1 1
Standby Current-Max 0.00001 A
Supply Current-Max 0.025 mA

Compare NX25P16VSI with alternatives

Compare W25X16VSFI with alternatives